Investigation of membrane stretching in BCB bonding

Home / Blog / Projects / Investigation of membrane stretching in BCB bonding

This project deals with the investigation of thermal expansion in the bonding of IMOS (Indium Phosphide Membrane on Silicon) on top of SOI (Silicon on Insulator) Wafer. It has been reported that the wafer undergoes stretching during the bonding process. The work done in this research is to identify the causes of stretching, we believe that the stretching that occurs is due to the BCB coating that helps in bonding the two layers. The experiment is conducted with various parameters to investigate whether the stretching is actually caused because of the BCB stress.